Agilent Technologies E6392B Manual de usuario descargar pdf (Pagina 14)

Revolutionize the role of test

• manufacturing solutions

• board – level

• electrical/process test

Increases in circuit density and circuit

complexity are forcing manufacturers

to look at a combination of available

test and inspection methodologies to

give the appropriate coverage in the

most cost-efficient manner. Automatic

inspection systems (x-ray and optical)

give you the actionable information

you need to be able to keep your

process in control. Electrical process

test (in-circuit) systems give you the

confidence that the product works.

These three different test and

inspection methodologies have some

overlap in terms of coverage but also

tend to have key individual strengths,

as seen in the figure below. Smart

combinations of these techniques

can increase test coverage while

actually reducing the overall cost of

test. Sharing information between

systems is easy with Agilent’s

AwareTest software, a proven

Intelligent Test solution that

enhances process tracking and

improvement by enabling data

integration and transfer and

real-time test monitoring.

For more information,

please visit our Web site at:

www.ate.agilent.com/go/

manufacturing

3070 powered in-circuit test (ICT) system

SJ-50 automated optical inspection (AOI) system

5DX automated x-ray inspection (AXI) system

Electronics Manufacturing Test

Manufacturing

• Shorts

• Opens

• Missing

• Gross shorts

• Lifted leads

• Polarity

• Missing non-electrical

• Bent pin/lead

• Wrong markings

AOI

• Billboard

• Misalignment

• Missing

socketed

parts

• Mis-orientation

AXI

• Insufficient

• Marginal joints

• Voids

ICT

• Wrong part

• Bad part

• PCB short

/open

Solder

• >95% solder coverage

• No access required

• Reduces field failures

• Prototype inspection

• No node-count limits

• 3D joint size/shape

Coverage of ICT: in-circuit test AXI: automated x-ray inspection AOI: automated optical inspection

Electrical

• Most versatile solution

• High-volume global mfg.

• Limited-access test

• On-board programming

• Combo test

Placement

• Replaces manual inspection • Pre-/post-reflow, end of Line • Can simplify ICT fixtures • 2D image processing of parts, joints

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