
PCIe 3.0 test Conclusions
1. Probing at pins of device not practical at PCIe 3.0 speeds of 8GT/s.
2. De-embedding may remove fixture effects and recover some jitter margin.
3. Voltage measurements more impacted by de-embedding noise compared
to jitter.
4. Calibration of the stressed eye for receiver test should minimize effect of
instrument noise.
5. Stressed eye for RX testing is referenced to the die pad for the receiver. TX
voltage and jitter parameters are generally referenced to the pin of the
device.
6. Calibration Channel is crucial for ensuring RX signal amplitudes are at the
proper level at the RX Die pad.
7. Advanced active probing required for PCIe 3.0 Protocol Analysis
8. Tools for full PCIe 3.0 TX and RX testing are available today.
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